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By Dave Lammers Judging by the presentations at the 2018 Symposium on VLSI Technology, held in Honolulu this summer, the semiconductor ..read more
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By Pete Singer, Editor-in-Chief The exploding use of Artificial Intelligence (AI) is ushering in a new era for semiconductor devices that ..read more
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By David Lammers After decades of R&D, two emerging memory types – the phase change memory-based 3D Xpoint, co-developed by Intel ..read more
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By Pete Singer, Editor-in-Chief Applied Materials has introduced a set of processes that enable cobalt to be used instead of tungsten and ..read more
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By Ed Korczynski, Sr. Technical Editor Long-delayed and extremely complex, extreme ultra-violet (EUV) lithography technology is now being ..read more
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By Dave Lammers Cobalt for middle-of-the-line and trench contacts emerged at the International Electron Devices Meeting, as Intel, ..read more
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By Dave Lammers The 63rd International Electron Devices Meeting brought an optimistic slant to transistor density scaling. While some ..read more
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