A new material that moves like skin while preserving signal strength in electronics could enable the development of next-generation wearable devices with continuous, consistent wireless and battery-free functionality. According to a study published today in Nature, an international team of researchers from Rice University and Hanyang University developed the material by embedding clusters of highly dielectric ceramic nanoparticles into an elastic polymer. The material was reverse-engineered to not only mimic skin elasticity and motion types, but also to adjust its diel ..read more

Mobix Labs, Inc., a fabless semiconductor company developing disruptive connectivity solutions that span from wired to next-generation wireless solutions, today announced it has completed its acquisition of RaGE Systems, Inc. (“RaGE Systems”), a leader in radio frequency joint design and manufacturing services based in Massachusetts. RaGE Systems specializes in developing products for 5G communications, mmWave imaging, and Software Defined Radio systems targeting commercial, industrial, defense, and aerospace sectors. The RaGE Systems team is recognized for their groundbreaking technology, rob ..read more

Arctic Semiconductor today announced that its low power, high performance 4×4 transceiver IceWings is powering a new small cell platform that has passed 3GPP specification and will soon be available in mass production. In addition to Arctic’s IceWings the platform includes Skyworks Solutions, Inc.’s (Skyworks) family of power amplifiers and timing products, as well as Synergy Design’s carrier grade 5G vRAN solutions. This cost optimized platform enables service providers and private network developers to deploy custom 5G networks at scale, a pivotal milestone in 5G infrastructure developm ..read more

Arteris, Inc., a provider of system IP that accelerates system-on-chip (SoC) creation and Andes Technology, a founding member of RISC-V International and a supplier of high-performance/low-power RISC-V processor IP, today announced their partnership to advance innovation for RISC-V based SoC designs for AI, 5G, networking, mobile, storage, AIoT and space applications. The Andes QiLai RISC-V platform is a development board with a QiLai SoC featuring the Andes’ RISC-V processor IPs along with Arteris FlexNoC interconnect IP used for on-chip connectivity. The QiLai SoC integrates the Andes 64-bit ..read more

Wise-integration and Leadtrend Technology Corporation, a specialist in analog and analog-digital mixed-mode IC designs, today announced the release of a GaN system-in-package (SiP) supporting consumer electronics applications. Their collaboration’s targeted application is a 65-watt USB PD adapter for high-speed charging of smartphones, laptops and other devices. The LD966LGQALVE High Voltage Multi-Mode PWM Controller of Flyback with GaN integrated includes Leadtrend’s silicon die flyback controller and Wise-integration’s 650V e-mode gallium-nitride (GaN) transistor die in a SiP ..read more

TECHCET— the electronic materials advisory firm providing business and technology information — is forecasting total semiconductor revenues in 2024 to increase by nearly 12%, hitting $610B. The excitement around this forecast is dampened by the fact that 2024 revenues fall short of 2021 by >$40B.  However, looking into the future, 2025 is forecasted to be a gangbuster year with 27% growth, smashing the previous revenue record. The main indicator for the 2025 upshoot is past cyclical history in the market. Semiconductor materials revenues have increased over Q1 2023 albeit slowly. Mate ..read more

Teradyne, Inc., a supplier of automated test equipment, today announced shipment of its 8,000th J750 semiconductor test platform. This milestone has been achieved with V-Test, a leading outsourced semiconductor assembly and test (OSAT) vendor in China. Deployed at all the world’s leading semiconductor chip manufacturers, the Teradyne J750 tester includes wafer sort and final test solutions for microcontroller units, wireless devices, image sensors, and more. J750 testers lead the industry in quality, time to market, and cost effectiveness, delivering higher throughput and increased site count ..read more

SEMI Europe today announced the opening of the Call for Abstracts for SEMICON Europa 2024, to be held November 12-15 at Messe München in Munich, Germany. Selected speakers will share their expertise at the Advanced Packaging Conference (APC), Fab Management Forum (FMF), MEMS & Imaging Sensors Summit and during presentations on the show floor. Europe’s premier event connecting the entire electronics design and manufacturing supply chain, SEMICON Europa 2024 will gather industry-leading experts and innovators to explore cutting-edge technolog ..read more

Silicon Catalyst, an incubator exclusively focused on accelerating semiconductor solutions, announced that Analog Bits, Inc. has joined as a new member of its In-Kind Partner (IKP) ecosystem. Analog Bits is the leader in developing and delivering low-power integrated clocking, sensors and interconnect IP that are pervasive in virtually all of today’s semiconductors. Portfolio Companies in the Silicon Catalyst Incubator will gain direct access to the Analog Bits wide portfolio of precision clocking macros PLLs and XTAL and RC Oscillators, Sensors to monitor Temperature, Voltage Drops, Volt ..read more

EdgeCortix Inc., a fabless semiconductor company specializing in energy-efficient AI processing at the edge, today unveiled its next-generation SAKURA-II Edge AI accelerator. This state-of-the-art platform, paired with EdgeCortix’s innovative second generation Dynamic Neural Accelerator (DNA) architecture, is engineered to tackle the most challenging Generative AI tasks in the industry. Designed for flexibility and power efficiency, SAKURA-II empowers users to seamlessly manage a wide range of complex tasks including Large Language Models (LLMs), Large Vision Models (LVMs), and multi-modal tra ..read more