Tokyo, Japan, March 15, 2024 – Toray Industries, Inc., announced today that it has developed an insulating resin material for hybrid bonding (micro bonding). The material is based on Semicofine and Photoneece. These are high-heat-resistant polyimide coatings for semiconductor and display devices. The new material combines a conventional polyimide coating agent with the company’s processing and bonding technologies. It can enhance the yields and reliability of semiconductor devices in the hybrid bonding process, which entails bonding semiconductor chips with metal electrodes. Toray will push ah ..read more

SINGAPORE – A research team led by the Agency for Science, Technology and Research (A*STAR) in partnership with National University of Singapore (NUS) has created an innovative microelectronic device that can potentially function as a sustainable, high-performance “bit-switch”1. This paves the way for future computing technologies to process data much faster while using significantly less energy. By harnessing tiny, stable and speedy magnetic whirls called skyrmions, the device can operate using 1,000 times less power than commercial memory technologies. This discovery was reported in the sci ..read more

The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the IEEE Electronics Packaging Society. ECTC 2024 will be held May 28-31 at the Gaylord Rockies Resort & Convention Center, Aurora (Denver) CO. The technical program contains papers covering leading edge developments and technical innovations across the packaging spectrum. Topics include advanced packagi ..read more

The 20th Annual IMAPS Device Packaging Conference (DPC 2024) will be held March 18-21, 2024, at the WeKoPa Resort and Conference Center in Fountain Hills, Arizona. This esteemed event brings together industry engineers, researchers and top experts involved in advanced packaging and microelectronics assembly with a multi-faceted technical program and unique networking events. The technical content includes an unrivaled, concurrent 3-track program with 108 speakers and poster presentations covering topics related t Heterogeneous 2D & 3D Integration, Fan-Out, Wafer/Panel Level Packaging & ..read more

The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the IEEE Electronics Packaging Society. ECTC 2024, taking place this year May 28- May 31, 2024 in Denver, CO at the Gaylord Rockies Resort & Convention Center. Standing at the edge of the Front Range, Gaylord Rockies Resort & Convention Center, this Denver International Airport hotel, showcases the sta ..read more

Hayward, CA, USA –  Gel-Pak, a Delphon company and a global leader in elastomer-based materials and protective carriers for the semiconductor, medical, and electronics industries, is pleased to announce the launch of its Gel-Probe products. This new line features enhanced probe tip cleaning and polishing solutions designed for semiconductor test applications. In the late 1990’s Gel-Pak pioneered the Gel-Wafer, the first elastomer-based probe tip cleaning product. Today, the company is making a strategic reentry into the market with its enhanced Gel-Probe line which currently includes the ..read more

By Raja Swaminathan [AMD] Chip Scale Review May • June • 2022   The next frontier: Enabling Moore’s Law using heterogeneous integrationDownload ..read more

Large-size multi-layered fan-out RDL multi-chip module packaging By Nicholas Kao, Jay Li, Jackson Li, Yu-Po Wang [Siliconware Precision Industries Co., Ltd] This article was published in the March April 2022 issue of Chip Scale Review Chip Scale Review_Mar-Apr_2022- SPIL PreviewDownload ..read more

Since the invention of metaloxide-semiconductor(MOS) integrated circuits in the early 1960s, the speed, capacity, and complexity of the chips have increased dramatically, roughly following Moore’s Law, owing to various technological and process breakthroughs that doubled the transistor count per chip area every two to three years. By Kunjesh Agashiwala, Junkai Jiang, Ankit Kumar, Chao-Hui Yeh, Kaustav Banerjee [University of California, Santa Barbara] This article was published in the November December 2021 issue of Chip Scale Review ..read more

The Zeta-20 is a fully integrated optical profiling microscope that provides 3D metrology and imaging capability in a compact, robust package. The system is powered by ZDot technology, which simultaneously collects high-resolution 3D data and a True Color infinite focus image. The Zeta-20 3D optical microscope supports both R&D and production environments with Multi-Mode optics, easy-to-use software, and a low cost of ownership. The Zeta-20HR configuration is designed to address advanced solar cell metrology requirements. Product Description The Zeta-20 benchtop optical profiler is a non-c ..read more