3D InCites
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3D InCites was founded in 2009 by Francoise von Trapp to provide an alternative source of information focused on interaction and participation, in an effort to stir up interest in 3D IC integration & 3D packaging technologies. An interactive web community where the members can share information & discussion of technologies & trends that will lead to market adoption of 3D integration technologies.
3D InCites
1d ago
The Hierarchy of the Re’s
You are probably familiar with the phrase “reduce, reuse, recycle.” You may have heard that it’s best to do things in that order. I suspect that you aren’t aware of starting with Refuse. As a verb, refuse means to say no to something. When individuals refuse to buy something, that saves all the resources and energy needed to make the item.
Refuse isn’t a popular term in the business world. That’s understandable. After all, if no one buys your products, you don’t have a viable business. I want to reframe Refuse. It applies when a company refuses to work with suppliers ..read more
3D InCites
2d ago
Keeping pace with Moore’s law continues to be challenging and is driving the adoption of innovative packaging technologies that support continued system scaling while doing so at lower costs than comparable monolithic devices.
These packaging technologies disaggregate what would typically be a homogenous, monolithic device — like an ASIC or system-on-chip (SoC) — into discrete, unpackaged dies, known as chiplets, specifically designed and optimized for operation within a package in conjunction with other chiplets (Figure 1). This is also referred to as heterogeneous integration (HI), whe ..read more
3D InCites
4d ago
Certification and Ongoing Monitoring Assures Customers of Manufacturing Operations’ ESD Control and Safety
ESCONDIDO, Calif. – April 11, 2024 – QP Technologies, a leading provider of innovative microelectronic packaging and assembly solutions, today announced it has been certified ANSI/ESD S20.20-compliant by TÜV SÜD America Inc. – one of only six certification bodies accredited to issue ESD S20.20 certificates. Established and governed by the American National Standards Institute (ANSI), the ESD S20.20-2021 standard provides requirements for establishing, implementing, and maintaining an elec ..read more
3D InCites
6d ago
Mike Gianfagna, in his blog for SemiWiki, declared that “MZ Technologies is a unique company that enables multi-die design by providing critical planning and analysis tools that sit above the traditional EDA design flow.”
He went on to point out that, given a set of constraints, GENIOTM delivers a good result. He then posed some interesting questions: What is the right set of constraints? What type of stack (for 3D), what type of interposer (for 2.5D) and what type of placement of blocks and pins will deliver the best result? These, Mike says, are just some of the questions t ..read more
3D InCites
1w ago
The global semiconductor industry is growing steadily as integrated circuits (ICs) are now a pervasive part of our everyday lives. Despite recent supply shortages and other challenges, semiconductors are nevertheless projected to become a US$1 trillion industry by 2030, with more than two-thirds of overall growth expected to be driven by automotive, computing/data storage and wireless technologies.
While the lion’s share of this total will belong to advanced devices manufactured on 300mm and larger wafers, the 200mm manufacturing segment has a vital role to play in helping the industry reach a ..read more
3D InCites
1w ago
MILPITAS, Calif. ─ April 8, 2024 ─ SEMI, the industry association serving the global electronics design and manufacturing supply chain, today applauded the United States Department of Commerce’s announcement of a Preliminary Memorandum of Terms for an award under the CHIPS and Science Act to support the construction of Taiwan Semiconductor Manufacturing Company (TSMC) chip manufacturing facilities in Arizona. The award includes $6.6 billion in grants, as much as $5 billion in loans, and an investment tax credit.
“We applaud the U.S. Department of Commerce for taking this significant step to en ..read more
3D InCites
1w ago
SEMI University In-Person Courses Aim to Help the Semiconductor Industry Workforce Build Skills, Advance in Careers
Aiming to help the global semiconductor workforce expand its skills to address the talent gap, SEMI today announced the expansion of the SEMI University learning platform to include in-person training. Complementing SEMI U online courses, the semiconductor curriculum is designed for technicians, engineers, and non-technical staff ranging from new hires to experienced workers looking to advance their careers. The courses cover subjects including front-end and back-end manufacturin ..read more
3D InCites
1w ago
The geopolitical race to take the lead in semiconductors is heating up as global investments in semiconductor manufacturing take hold.
Several weeks ago, the Department of Commerce finally made a big US CHIPS Act award, giving Intel $8.5 billion of the allotted 38 billion set to go to semiconductor manufacturing. Along with the award came some additional grants and loans. You can find more details on the Intel package in this blog by Phil Garrou. The Intel award came after a great deal of speculation about when and who will get the bigger awards from the US CHIPS Act.
This week, TSMC was award ..read more
3D InCites
1w ago
An AI package is like a puzzle made up of individual pieces of different sizes and shapes, each one essential to the final product. Together, these pieces are typically integrated into a 2.5D IC package designed to reduce footprint and maximize bandwidth.
A graphic processing unit (GPU) and multiple 3D high-bandwidth memory (HBM) stacks provide the major pieces in the AI puzzle. These puzzle pieces are first assembled on top of a silicon interposer. An advanced IC substrate (AICS) provides the foundation on which the 2.5D package is built.
While we could go on to great lengths to discuss the m ..read more
3D InCites
1w ago
Irvine, CA – Henkel today announced that it has commercialized a semiconductor capillary underfill encapsulant to address the unique requirements of the market’s most demanding advanced packages, like those used in artificial intelligence (AI) and high-performance computing (HPC) applications. Loctite Eccobond UF 9000AE protects large die within flip-chip BGA (FCBGA), high-density fan-out (HD-FO), and 2.5-D advanced packaging devices.
HD-FO and 2.5-D wafer-level packaging techniques have seen significant progress in the last ten years, having achieved dramatic increases in I/O, efficiency, and ..read more