LoRa (long-range) technology ensures reliable long-range communication between a node and gateway, making it well-suited for a range of Internet-of-Things (IoT) applications. The purpose of building a LoRa node is to reduce costs while ensuring long-term, low-power use for devices. LoRa’s low power is affected by several features, covered below. Figure 1. Basic LoRa architecture. Features Smart programming. The written code must be “smart,” ensuring deep sleep when not in use. For example, the networking part of forest fire detection sensors remains in sleep mode if no fire is detected at the ..read more

Q-Tech Corporation introduces an advanced oven-controlled crystal oscillator (OCXO) Series for New Space applications. Designed by the company’s German affiliate, AXTAL, the AXIOM75Sx Series features both ultra-low phase noise (close-in and noise floor) and the radiation hardness required for high-performance low-earth orbit (LEO) satellite timing and frequency generation applications. Available for the frequencies of 10MHz (AXIOM75SL) and  50-400MHz(AXIOM75SH), these devices deliver low phase noise and noise floor down to -180dBc/Hz. Testing and screening to specific customer requi ..read more

THine Solutions, Inc. announced the new THEIA-CAM 13MP PDAF Camera, THSCJ101, for NVIDIA Jetson Orin NX and Jetson Orin Nano platforms. Along with its pre-optimized ISP firmware and Linux driver, Jetson users are now able to easily integrate advanced imaging capabilities into their systems. The THSCJ101 Kit is a Camera reference design kit for embedded camera applications using the NVIDIA Jetson Orin NX or Jetson Orin Nano platform. It is based on THine’s THP7312-P Image Signal Processor (ISP) and Sony’s IMX258 13MP CMOS PDAF image sensor. THine’s optimized ISP firmware provides ultra-quick a ..read more

Silicon Labs has announced a new family of wireless system-on-chip (SoC) products called the xG22E. This new SoC family is designed to operate within the ultra-low power requirements of battery-free, energy harvesting applications. The xG22E family consists of three SoCs: the BG22E, MG22E, and FG22E. These are described as Silicon Labs’ most energy-efficient SoCs to date. They are intended to enable IoT device makers to build high-performance wireless devices that can operate on energy harvested from sources like indoor/outdoor light, ambient radio waves, and kinetic motion. To support the de ..read more

ASRock Industrial is thrilled to announce the launch of its latest innovation, the SBC-262M-WT 3.5” SBC Motherboard, a new benchmark in edge computing, powered by the advanced Intel Atom x7433RE Processor (Amston Lake). Designed with enhanced CPU and GPU performance, this motherboard ensures an optimal balance between performance, cost-efficiency, and versatility for various computing needs at the edge. Supporting DDR5 4800 MHz memory, the SBC-262M-WT features an extensive array of I/O capabilities, including triple 4K display outputs, featuring dual LAN one support up to 2.5G with Intel TSN ..read more

MIKROE has announced that 500 development boards incorporating the mikroBUS socket are now available from top semiconductor makers. The mikroBUS development socket standard enables any of MIKROE’s 1600+ compact Click peripheral boards to be used on the development board, cutting embedded development time and prototyping dramatically. The 500th board to be released is the PIC32CK GC Curiosity Ultra Development board from Microchip – the company that kickstarted this journey by being the first to adopt the mikroBUS standard. Other significant releases recently inclu ..read more

Fixed-wireless access is a special use case of enhanced mobile broadband, one of the three use cases specified for 5G. FWA brings different challenges for deployment than eMBB. Mobile network operators (MNOs) are at the beginning of a wave of delivering new 5G stand-alone (SA)-based data services. Where 4G has one defined data service, 5G has four core mobile data services leveraging different features of the technology. Ultra-Reliable Low Latency Communications (URLLC), which leverages 5G’s less than 1 ms over-the-air low latency and reliability guarantees (less than 0.001% of 20-byte packet ..read more

TDK Corporation announced the launch of its new M.2 2280 type SSD [SNP1A series], supporting PCI Express (PCIe)* and NVM Express (NVMe)**. The SSD integrates NAND flash memory, TDK’s GBDriver GX1 controller IC, and an internal backup power circuit, making it highly resistant to power interruptions. In recent years, the number of SATA ports on the host CPU side has been decreasing, while demand for PCIe/NVMe-connected SSDs has been increasing. Most SSDs compatible with PCIe/NVMe interfaces focus on transfer speed, catering to the needs of applications that include servers, high-performance com ..read more

Infineon Technologies AG has unveiled the latest addition to its product lineup with the introduction of the PSOC™ Edge family of microcontrollers (MCUs) tailored specifically for machine learning (ML) applications. The release includes three distinct series, namely the E81, E83, and E84, each offering a flexible and compatible array of performance levels, features, and memory options. Equipped with comprehensive system design tools and software support, developers can seamlessly transition from idea to market-ready product, empowering the realization of innovative ML-enabled solutions for the ..read more

Microchip Technology has expanded its Serial SRAM product line to include larger densities of up to 4 Mb and increased Serial Peripheral Interface/Serial Quad I/O Interface (SPI/SQI) speed to 143 MHz. The 2 Mb and 4 Mb devices are designed to provide a lower-cost alternative to traditional parallel SRAM products and include optional battery backup switchover circuitry in the SRAM memory to retain data on power loss.   Unlike parallel RAM, which requires large packages and at least 26–35 microcontroller (MCU) I/Os to interface, the Microchip serial SRAM devices come in a low ..read more