A new technical paper titled “Overcoming Ambient Drift and Negative-Bias Temperature Instability in Foundry Carbon Nanotube Transistors” was published by researchers at MIT, Stanford University, Carnegie Mellon University and Analog Devices. Abstract: “Back-end-of-line (BEOL) logic integration is emerging as a complementary scaling path to supplement front-end-of-line (FEOL) Silicon. Among various options for BEOL logic, Carbon... » read more The post Improving The Air-Stability and NBTI Reliability of BEOL CNFETs appeared first on Semiconductor Engineering ..read more

A new technical paper titled “Computing high-degree polynomial gradients in memory” was published by researchers at UCSB, HP Labs, Forschungszentrum Juelich GmbH, and RWTH Aachen University. Abstract “Specialized function gradient computing hardware could greatly improve the performance of state-of-the-art optimization algorithms. Prior work on such hardware, performed in the context of Ising Machines and related... » read more The post Mixed Signal In-Memory Computing With Massively Parallel Gradient Calculations of High-Degree Polynomials appeared first on Semiconductor Engineering ..read more

Picking the optimal epoxy molding compound material is key for minimizing carrier and package warpage. The post Novel Molded FCBGA Package Platform For Highly Reliable Automotive Applications appeared first on Semiconductor Engineering ..read more

Determining the impact of CT recess depth and critical dimensions on source/drain to via series resistance. The post Reducing Transistor Capacitance At The 5nm Node Using A Source/Drain Contact Recess appeared first on Semiconductor Engineering ..read more

Maintaining robust production capabilities for mature nodes is more important than ever. The post Legacy Process Nodes Are Critical To Many Industries appeared first on Semiconductor Engineering ..read more

A series of technological advancements and market trends continue to drive innovation. The post Semiconductor Photomask Market Poised For Another Year Of Growth appeared first on Semiconductor Engineering ..read more

Chiplet-based products must accommodate small differences in die size and bump pitch, placing new demands on manufacturing tools. The post How Die Dimensions Challenge Assembly Processes appeared first on Semiconductor Engineering ..read more

Development methodologies combine old and new techniques, but getting any new material into high-volume manufacturing is a complex process. The post New Materials Are in High Demand appeared first on Semiconductor Engineering ..read more

Controlling interference in today’s SoCs and advanced packaging requires a combination of innovative techniques, but new challenges emerge. The post Managing EMI in High-Density Integration appeared first on Semiconductor Engineering ..read more

Technology communities make critical linkages on integrating AI. The post Smart Manufacturing, Smart Data-AI, And Future Of Computing appeared first on Semiconductor Engineering ..read more