Design Tool Certifications Support Newest Processes and Other Enablement Milestones Today at the TSMC 2024 North America Technology Symposium, Siemens Digital Industries Software announced that ongoing collaboration with longtime partner TSMC has successfully achieved multiple new product certifications and project milestones for TSMC’s newest and most advanced processes. For mutual customers, these certifications allow the development of innovative and highly differentiated end-products using best-in-class EDA software industry-leading silicon process,es and advanced packaging technologies ..read more

StratEdge has been designing and manufacturing packages for high-power, high-frequency compound semiconductors since the early 1990s, with much attention focused on gallium arsenide (GaAs) and gallium nitride (GaN). Because of its ability to operate at very high currents and high voltages, gallium nitride GaN is widely used in applications for high-power devices operating at high frequencies. While much attention is given to GaN devices, what is often overlooked is the package in which the GaN device is attached and the way the device is attached to the package. It’s well known that GaN device ..read more

We all knew it was coming….it was just a matter of time until it was announced. The Department of Commerce unveiled its 5th program under the CHIPS and Science Act, this time with TSMC, or more accurately TSMC Arizona Corporation (TSMC-AZ), a subsidiary of Taiwan Semiconductor Manufacturing Company Limited. The DoC signed a non-binding preliminary memorandum of terms (PMT) to provide up to $6.6B in direct funding under the CHIPS and Science Act. TSMC will reportedly invest more than $65B for three leading-edge fabs in Phoenix AZ. [Signing of the PMT triggers a comprehensive due diligence proce ..read more

It is popular for mainstream media to publicize different industry’s energy consumption and environmental habits. The semiconductor industry is not immune to this occasional finger-pointing concerning energy consumption, water consumption, and hazardous chemicals that are used to produce the chips that are ubiquitous in our daily lives. Major publications highlight how the industry is consuming resources and tell us about the significant mountains the industry needs to climb to get to carbon neutrality. However; they also fail to acknowledge the efforts the industry is making to achieve carbon ..read more

NIJMEGEN, THE NETHERLANDS – Trymax Semiconductor Equipment B.V.(Trymax), a global leader in plasma solutions, today announced it has received multi-system orders for its NEO 2400 series and NEO2000UV from a large Asia-based foundry. ‘This partnership is a testament to the dedication and innovation of our team at Trymax. We are committed to delivering high-quality products that align seamlessly with the evolving needs of the industry,” stated Peter Dijkstra, CCO of Trymax. ‘We believe that this collaboration will not only strengthen our relationship with our customers but will also underline ou ..read more

On-demand, actionable insight increases warehouse productivity and maximizes employee safety Brewer Science, Inc., a pioneering leader in smart device technology, proudly introduces its latest innovation in workplace safety and productivity enhancement – the Smart Warehouse Monitor system. Designed to revolutionize industrial and warehouse settings, this cutting-edge solution offers actionable, on-demand information to ensure employee safety, drive productivity, and enhance operational efficiency. With a relentless commitment to innovation and leveraging over 40 years of expertise in mate ..read more

Funds to  Strengthen Domestic Semiconductor Supply Chain MILPITAS, Calif. ─ April 16, 2024 ─ SEMI, the industry association serving the global electronics design and manufacturing supply chain, today applauded the United States Department of Commerce’s announcement of a Preliminary Memorandum of Terms for an award under the CHIPS and Science Act to support the expansion of Samsung Electronics’  presence in Texas and the company’s development and production of leading-edge chips. The award includes $6.4 billion in grants and an investment tax credit to help fund two new leading-edge l ..read more

If you have been following the announcements from Bob Patti and his company, NHanced Semiconductors, it would not be surprising if you were a bit confused about how all these announcements will be coming together. I know IFTLE was, so we approached longtime friend Bob Patti and came up with the following information. NHanced ultimate goal is to supply both the commercial and military/aerospace markets. Aerospace and Defense currently account for 2/3 of its business. NHanced’s technical capabilities include: Advanced Packaging: HDI edge packaging Chiplet integration TSV Insertion Covalent oxid ..read more

The Hierarchy of the Re’s You are probably familiar with the phrase “reduce, reuse, recycle.” You may have heard that it’s best to do things in that order. I suspect that you aren’t aware of starting with Refuse. As a verb, refuse means to say no to something. When individuals refuse to buy something, that saves all the resources and energy needed to make the item. Refuse isn’t a popular term in the business world. That’s understandable. After all, if no one buys your products, you don’t have a viable business. I want to reframe Refuse. It applies when a company refuses to work with suppliers ..read more

Keeping pace with Moore’s law continues to be challenging and is driving the adoption of innovative packaging technologies that support continued system scaling while doing so at lower costs than comparable monolithic devices.  These packaging technologies disaggregate what would typically be a homogenous, monolithic device — like an ASIC or system-on-chip (SoC) — into discrete, unpackaged dies, known as chiplets, specifically designed and optimized for operation within a package in conjunction with other chiplets (Figure 1). This is also referred to as heterogeneous integration (HI), whe ..read more