Mouser Electronics and Murata Present New eBook Focused on Micro-Electromechanical Systems (MEMS) Technology
EEJournal » Embedded
by Amelia Dalton
6h ago
May 9, 2024 – Mouser Electronics, Inc., the New Product Introduction (NPI) leader empowering innovation, today announces a new eBook in collaboration with Murata, exploring the use of micro-electromechanical systems (MEMS) technology device design. In 9 Industry Experts Discuss MEMS Technology, industry thought leaders offer unique perspectives on the benefits and applications of MEMS technology in consumer electronics, medical, Internet of Things (IoT) and industrial implementations. Chapters on inertial measurement units (IMUs) and ..read more
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Digital Signal Processing and the AI Architecture Evolution
EEJournal » Embedded
by Amelia Dalton
12h ago
This week’s Fish Fry podcast is all about digital signal processing! Pulin Desai (Cadence Design Systems) joins me to chat about recent developments in vision, radar and lidar applications, AI inference trends that are driving the need for flexible and programmable digital signal processing, and why DSPs are indispensable in the new world of artificial intelligence. Also this week, I check out a new PCB prototype developed at the University of Washington that is almost completely recyclable. (Spoiler Alert: It can turn into jelly!)   Links for May 10, 2024 Why a DSP is Indispensable in ..read more
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LDRA’s New Security-First Capabilities Meet Missions to Mars and Colonies in Space
EEJournal » Embedded
by Max Maxfield
2d ago
I don’t know about you, but I’m really starting to get excited about all the space-related activities that are going on at the moment. I remember the thrill of Apollo 11 and humankind’s first steps on the moon. And I remember the sadness associated with my eventually coming to the realization that the Apollo 17 landing in 1972 would be the last time we visited the moon for a while. I was excited by the launch of Voyager 2 in August 1977 followed by Voyager 1 in September 1977 (I know… it’s best not to ask). I’ve avidly watched all the Mars Rover missions from their launches to their final com ..read more
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Ultra-low Power Fuel Gauging for Rechargeable Embedded Devices – Nordic Semiconductor and Mouser
EEJournal » Embedded
by Amelia Dalton
2d ago
  Fuel gauging is a critical component of today’s rechargeable embedded devices. In this episode of Chalk Talk, Amelia Dalton and Robin Saltnes of Nordic Semiconductor explore the variety of benefits that Nordic Semiconductor’s nPM1300 PMIC brings to rechargeable embedded devices, the details of the fuel gauge system at the heart of this solution and the five easy steps that you can take to implement this solution into your next embedded design.  Click here for more information about Nordic Semiconductor nPM1300 Power Management ICs ..read more
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Tellabs Evolves Modern Enterprise Networking with In-Wall FlexSym ONT203W for fiber-based Passive Optical Networks
EEJournal » Embedded
by Amelia Dalton
2d ago
CARROLLTON, Texas, May 07, 2024 (GLOBE NEWSWIRE) — Tellabs, a leading provider of Passive Optical Network (PON) solutions, announces that Tellabs FlexSym® Optical Network Terminal 203W (FlexSym ONT203W), along with System Release 31.4 (SR31.4) software is progressing with first customer deployments. The FlexSym ONT203W offers in-wall, discreet, and secure options for advancing the Internet of Things and Smart Building connectivity over fiber. Its unique form allows for two-step modular assembly aligning with construction phases. The power module is installed first, without the ONT mo ..read more
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ST rolls a new FD-SOI microcontroller with phase-change memory (PCM) for automotive applications
EEJournal » Embedded
by Steven Leibson
2d ago
Like a battered and bruised prizefighter, phase-change memory (PCM) refuses to stay down or give up the fight. Although it got a black eye and bloody nose from its Micron 3D XPoint and Intel Optane misadventures, PCM has found its way into microcontrollers, thanks to a collaboration between STMicroelectronics (ST) and Samsung. Back in 2018, ST announced that it was sampling microcontrollers with embedded PCM (ePCM) made with a 28nm FD-SOI (fully depleted silicon on insulator) process for the automotive market. Now, ST has announced the next generation of automotive microcontrollers with ePCM ..read more
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Outgassing: The Hidden Danger in Harsh Environments – Cinch Connectivity and Mouser
EEJournal » Embedded
by Amelia Dalton
3d ago
  In this episode of Chalk Talk, Amelia Dalton and Scott Miller from Cinch Connectivity Solutions chat about the what, where, and how of outgassing in space applications. They explore a variety of issues that can be caused by outgassing in these applications and how you can mitigate outgassing in space applications with Cinch Connectivity interconnect solutions.  Click here for more information about Cinch Space Mission Solutions ..read more
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Measure Pressure in Extreme Heat or Cryogenic Environments with PCB’s Newest Test Sensor
EEJournal » Embedded
by Amelia Dalton
4d ago
May 2, 2024 – Depew, NY – PCB Piezotronics (PCB®) is introducing our new Model 112A06 wide temperature range charge output piezoelectric pressure sensor. The 112A06 was designed to complement our cryogenic and high temperature pressure sensor line. It has an extremely wide operating temperature range from -400 to 662°F (-240 to 350°C). Model 112A06 features: UHT-12TM sensing element for more accurate, lower noise measurements at elevated temperatures Wide temperature range from -400°F to 662°F (-240°C to 350°C) Resonant frequency >200 kHz High sensitivity (2.6 pC/psi) Acceleration c ..read more
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Rogue Valley Microdevices Unveils 300mm MEMS Capability at its Upcoming Palm Bay, Florida Facility
EEJournal » Embedded
by Amelia Dalton
4d ago
MEDFORD, Ore. – May 1, 2024 – Rogue Valley Microdevices, an Oregon-based advanced manufacturing company specializing in microelectromechanical systems (MEMS), today announced that its new fab, currently under construction on the “Space Coast” of Florida will be 300mm capable. The company is the first pure-play MEMS foundry to announce 300mm capability for its customers, many of whom are innovators looking to transition from lab to fab with custom development requirements. A MEMS foundry that can handle 300mm wafers benefits customers who require post-CMOS processing since much of the world’s C ..read more
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MYIR Launches i.MX 93 based SOM for Industrial Applications
EEJournal » Embedded
by Amelia Dalton
4d ago
Shenzhen, China – May 6, 2024 – MYIR has launched a new embedded System on Module (SoM), the MYC-LMX9X, based on the NXP i.MX 9352 processor. This processor belongs to the high-performance i.MX 93 family, featuring dual ARM Cortex-A55 cores clocked at up to 1.7GHz and Cortex-M33 cores running at 250MHz. It also incorporates a 0.5 TOPS Neural Processing Unit (NPU), enabling cost-effective and lightweight AI applications. The MYC-LMX9X has a compact size, measuring merely 37mm by 39mm. In addition to the powerful i.MX 9352 CPU, it offer ..read more
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