Semiconductors are the fundamental building blocks of the electronics industry. These partly conductive goods include transistors, processors, and other electronic control pieces that are used in everything from mobile phones to automobiles and robots. Today, most semiconductor chips are made from silicon coated with another compound. This outer layer shields the semiconductor from the elements while keeping it connected to the outside world. Plating materials can range from tin to gold, with different sets of characteristics that bring along varied results. Surface finish standards in the sem ..read more

In this article, we compare the differences between Saw Dicing, Laser Dicing, Plasma Dicing, and Scribing Dicing. The thin wafer dicing equipment market may be divided into four categories based on dicing technology: Wafer Scribing and Breaking Saw Dicing Laser Dicing Plasma Dicing A wafer is a thin slice of semiconductor material, and dicing is the process of cutting semiconductors, glass crystals, and a variety of other materials. Dicing equipment is an instrument used in this operation. Because of the increasing need for smaller wafers and tougher die, dicing technologies are continually ch ..read more

There are various steps involved in the Dicing process listed below: Wafer Mount to the Tape Frame Dicing Process Through blades Wafer Microwash Process Wafer Inspection and Die Sorting The below image is showing the flow diagram of the Dicing process. What is the Dicing Process? The Dicing process is mostly used in the semiconductor packaging industry to separate Silicon wafers into individual chips. The Integrated Circuits are manufactured in a multistep process that converts raw materials into packaged devices that may be configured into electronic circuits. In other words, it is a process ..read more

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Introduction:- A Bond Test Process is performed to determine the strength of an adhesive to hold together two materials while being stressed. After the bond has been applied, it is tested the strength of the bond by exerting force on the adhesive in an attempt to detach it from the material. Purpose of Bond Test Process:- The overall bonding of a material may be thought of as its bond strength, which is determined by the sort of stress applied to the bond and the temperature at which the test is conducted. The direction of the force applied to the bond will also affect its strength. There are ..read more

Introduction:- Wire Bonding is the technique of establishing the electrical connections between a silicon chip and the external leads of a semiconductor device using very fine bonding wire during semiconductor device fabrication. These wires are made of materials such as Copper (Cu), Gold (Au), and Aluminum (Al). Wire Bonder machines such as ASM AB339 Eagle, ASM Eagle 60 Wire Bonder, ASM Eagle 589 Wire Bonder, Manual Wedge Wire Bonder MDB-2575, and various precious Wire Bonding tools are used such as Capillary and Wire Clamps. There are various Wire Bond methods which are as follows: 1) Thermo ..read more

Introduction: Die Attach is also commonly known in the Semiconductor industry as Die Bonding or Die, Mount. It is the process of attaching a silicon chip to the Die pad of the support structure, such as a leadframe or metal can header of the Semiconductor package. This is a critical step in the Semiconductor Backend manufacturing process and the use of specialized Die Attach/Die Bonding equipment is critical to ensure process productivity and quality. Die Attach/Die Bonder machines such as ESEC 2008, Datacon 8800, Canon Bestem D511F, ASM 838/868 Die Bonders, and various precision Die Attach/Di ..read more

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