Ubiquitous Gamers
Electronics Weekly
by David Manners
4h ago
Gamers play anywhere, on anything According to Statista Consumer Insights, Americans play games on a myriad of devices, with smartphone the clear number 1. The post Ubiquitous Gamers appeared first on Electronics Weekly ..read more
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NASA’s snake robot is propelled by screws
Electronics Weekly
by Steve Bush
12h ago
Pondering movement over a wide range of terrains and through complex 3d worlds, NASA’s Jet Propulsion Laboratory has come up with a snake-like robot called Eels – for Exobiology extant life surveyor. First prototyped in 2019 and now at Eels 1.0, it has 10 identical segments along its 4m body, which weighs 100kg. “There are ... The post NASA’s snake robot is propelled by screws appeared first on Electronics Weekly ..read more
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Celebrity generates cash
Electronics Weekly
by David Manners
14h ago
 98 years ago a Chicago radio station paid $1000 a day to AT&T for a radio feed from a courtroom in Tennessee where a criminal trial was underway. The fee was paid for a part of the trial where the defence lawyer called the prosecuting lawyer to give evidence as an expert witness on the Bible. The ... The post Celebrity generates cash appeared first on Electronics Weekly ..read more
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Existential Threat?
Electronics Weekly
by David Manners
14h ago
No one I know thinks AI is an existential threat to humanity but they’ve all read articles saying that it is. How come? A cynic might say it’s because a handful of technologists see a route to extracting the biggest tech budget in history: “We have to save humanity, Mr President, we must spend anything ... The post Existential Threat? appeared first on Electronics Weekly ..read more
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Fuji joins 3d printed electronics alliance
Electronics Weekly
by Steve Bush
14h ago
Fuji Corporation has joined 3d printed electronics association JAMES (Jetted Additively Manufactured Electronics Sources), which describes itself as establishing a collaborative community that brings together professionals and enthusiasts from various fields to drive additive manufacturing development in 3D printed electronics. The addition of Fuji “will allow both companies to work together on upcoming projects, share ... The post Fuji joins 3d printed electronics alliance appeared first on Electronics Weekly ..read more
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RISC-V Summit: Customisable vector unit
Electronics Weekly
by Steve Bush
17h ago
Semidynamics has announced a customisable vector unit for RISC-V processor cores, compliant with RISC-V vector specification 1.0. Vector unit are composed of several vector cores that perform multiple calculations in parallel. In this case, Semidynamics’ vector core can be tailored to support FP64, FP32, FP16, BF16, INT64, INT32, INT16 or INT8 data types depending on ... The post RISC-V Summit: Customisable vector unit appeared first on Electronics Weekly ..read more
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X-Fab offers 110nm BCD-on-SoI process
Electronics Weekly
by Steve Bush
18h ago
Mixed-signal chip maker X-Fab Silicon Foundries is X-Fab offering a 110nm BCD-on-SoI process, claiming to be the first to do so. Called XT011, it “reflects the need for greater digital integration and processing capabilities within analogue applications”, said X-Fab, claiming: “It brings together the appealing attributes associated with both SoI and DTI [deep trench isolation], ... The post X-Fab offers 110nm BCD-on-SoI process appeared first on Electronics Weekly ..read more
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Get Mannerisms, Gadget Master, the Daily and the Weekly, in newsletter form
Electronics Weekly
by Alun Williams
19h ago
Let our content come straight to you! Easily digestible newsletter emails straight to your inbox. And all the newsletters are mobile optimised. The post Get Mannerisms, Gadget Master, the Daily and the Weekly, in newsletter form appeared first on Electronics Weekly ..read more
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IBM and ASYMPT develop better chiplet bond
Electronics Weekly
by David Manners
21h ago
Researchers at IBM and ASMPT have developed a new way to bond chiplets that fuses copper and an oxide in layers that are just a few atoms thick using no solder. The result is a bond between chiplets that’s only around 0.8 microns, compared to the 150-30 microns being achieved by solder, or a combination ... The post IBM and ASYMPT develop better chiplet bond appeared first on Electronics Weekly ..read more
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UK hosts inaugural AUKUS AI and autonomy trial
Electronics Weekly
by Alun Williams
21h ago
The UK has hosted the first AUKUS AI and autonomy trial, with the aim of driving artificial intelligence into military use. Service personnel, scientists and engineers from the three AUKUS nations (Australia, United Kingdom, United States) combined for the exercise taking place on the Salisbury Plains. It saw “AI-enabled assets” involved in a collaborative swarm ... The post UK hosts inaugural AUKUS AI and autonomy trial appeared first on Electronics Weekly ..read more
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