AMD unveils Gen 2 Versal adaptive SoCs
Electronic Products Magazine
by Gina Roos
2d ago
AMD has introduced the second generation of its Versal adaptive system-on-chip (SoC) portfolio with the launch of the new Versal AI Edge Series Gen 2 and Versal Prime Series Gen 2 adaptive SoCs. These portfolios deliver solutions from edge sensors to centralized compute, offering increasing amounts of AI and adaptive compute to allow customers to select the right performance, power and area footprints for their applications. (Source: AMD) The first devices in the Versal Series Gen 2 portfolio build on the first generation with new AI engines, delivering up to 3× higher TOPs-per-watt th ..read more
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Samtec shrinks RF edge launch connectors
Electronic Products Magazine
by Gina Roos
2d ago
Samtec, Inc. has expanded its line of RF edge launch connectors with a narrow body design that is 33% smaller than traditional edge launch connectors. These connectors are often used in labs for high-frequency test and measurement applications, high-speed digital component test and evaluation boards. The new RF edge launch connectors are available in a range of frequency capabilities: DC to 67 GHz (185-EL Series), DC to 50 GHz (240-EL Series) and DC to 40 GHz (292-EL Series). They offer interfaces of 1.85 mm, 2.40 mm and 2.92 mm, respectively, and up to 500 mating cycles. (Sou ..read more
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Microchip delivers larger density, faster serial SRAMs
Electronic Products Magazine
by Carolyn Mathas, contributing writer
2d ago
A previously recognized drawback is the wide speed gap between serial SRAMs and their parallel SRAM cousins. Addressing this disparity, Microchip Technology Inc. has expanded its serial SRAM portfolio with larger densities of up to 4 Mbit, offering increased serial peripheral interface/serial quad I/O Interface (SPI/SQI) speed to 143 MHz. The new 2-Mbit and 4-Mbit devices now provide a lower-cost alternative to parallel SRAMs as well as include an optional battery backup switchover circuitry in the SRAM memory to retain data on power loss. (Source: Microchip Technology Inc.) The new serial ..read more
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Bel Fuse expands fuse line for EVs
Electronic Products Magazine
by Gina Roos
2d ago
Bel Fuse Inc. has extended its fuse portfolio for electric and hybrid vehicles with 800-V protection devices, joining the company’s line of 500-V and 1,000-V fuses. These include the new 800-V 0AKJ, 0ALB, 0ALC, 0ALD and 0ALF series. These fuses are available in a variety of formats and mounting options. The typical operating temperature range is -40℃ to 100℃ with some products featuring a range of up to 125℃. The fuses also feature a wide range of current ratings, from 5 A to 800 A, depending on the application. The fast-acting 0AKJ square-body fuse series for short circuit protection offers ..read more
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Wireless MCU boasts neural co-processor for AI/ML
Electronic Products Magazine
by Carolyn Mathas, contributing writer
6d ago
Alif Semiconductor recently launched the Balletto family, claimed as the world’s first Bluetooth Low Energy (LE) wireless microcontroller (MCU), featuring hardware optimization for AI/ML workloads. The family is designed to support the implementation of sophisticated AI/ML functions such as speech recognition, adaptive noise cancellation, vocal targeting and beam forming in true wireless stereo (TWS) earbuds, and sensor fusion in lifestyle wristbands and other space-constrained devices. Alif Semiconductor’s Balletto MCUs (Source: Alif Semiconductor) Key features include high-performance aud ..read more
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Embedded world 2024: MCUs and SoCs
Electronic Products Magazine
by Gina Roos
1w ago
The annual embedded world 2024 Exhibition & Conference in Nuremberg, Germany, April 9-11, showcases the latest innovations in embedded system development. Key themes at this year’s show include edge AI, embedded vision, IoT, electronic displays, connectivity, safety and security, IC and IP design and embedded OS. This year’s keynote addresses the challenges of AI at the edge, a growing trend highlighted with the most recent product launches for microcontrollers (MCUs) and system on chips (SoCs). Improving AI/ML performance is a big driver for both startup and leading chipma ..read more
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Micron claims first quad-port SSD for SDVs
Electronic Products Magazine
by Carolyn Mathas, contributing writer
1w ago
Micron Technology, Inc. is now sampling its automotive-grade 4150AT SSD, claiming the industry’s first quad-port that is capable of interfacing with up to four systems on chips (SoCs) to centralize storage in software-defined vehicles (SDVs). Key features include single-root input/output virtualization (SR-IOV), a PCIe Generation 4 interface and ruggedized automotive design. Until now, SSD solutions were not optimized for the increased architectural efficiency of a centralized system and were implemented locally with each vehicle function, often requiring a PCIe switch to connect a drive ..read more
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Embedded world 2024: COMs, SIPs and SOMs
Electronic Products Magazine
by Gina Roos
1w ago
Innovations in embedded modules are on full display at embedded world 2024. Modules, including computer-on-modules (COMs), system-in-packages (SIPs) and system-on-modules (SOMs), are designed to reduce hardware design complexity, and now more than ever software integration. Many of these modules are addressing the growing demand for artificial intelligence (AI) and machine learning (ML), particularly for edge AI, a big demand driver for many of the latest processors. These embedded modules are used across industries from consumer electronics to industrial, including a range of IoT application ..read more
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Ceva Launches multi-protocol wireless platform IPs
Electronic Products Magazine
by Carolyn Mathas, contributing writer
1w ago
Ceva, Inc. has launched Ceva-Waves Links, a new family of multi-protocol wireless platform IPs. Addressing smart-edge device connectivity, the Links family supports today’s wireless standards to meet the demand for enhanced connectivity in consumer IoT, industrial, automotive and personal computing markets. These IPs include Wi-Fi, Bluetooth, Ultra-Wideband (UWB) and IEEE 802.15.4 (for Thread/Zigbee/Matter), offering qualified, easy-to-integrate, multi-protocol wireless communications subsystems with optimized co-existence schemes and adapted to a variety of radios and configurations ..read more
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Ultrasonic ToF sensor targets IoT and robotics
Electronic Products Magazine
by Gina Roos
1w ago
TDK Corp. has announced distribution availability of its second-generation InvenSense SmartSonic ICU-10201 ultrasonic time-of-flight (ToF) sensor for IoT and robotics applications. With improved on-chip processing, the ultrasonic ToF offers greater computing power in a smaller package. (Source: TDK Corp.) Enabling low-power IoT and robotics products, the ICU-10201 ultrasonic ToF offers the sensitivity needed for accurate obstacle avoidance or proximity sensing in applications such as robotics, drones and robot vacuum cleaner (RVC) devices. The sensor also can be used in applications that re ..read more
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