Nexperia’s high-current electronic fuses feature an integrated auto-reset low-resistance FET that minimizes operating power dissipation. The post Electronic fuses deliver high current limiting accuracy appeared first on Electronic Products ..read more

These Silicon 100 companies have the potential to deliver technologies that will have a huge impact on the future of the semiconductor industry. The post Silicon 100: Startups to watch appeared first on Electronic Products ..read more

Rohm Semiconductor has unveiled three new products in the PMR100 series of standard metal-plate shunt resistors. These new models offer a rated power of 5 W and resistance values of 0.5 mΩ, 1.0 mΩ and 1.5 mΩ in the 2512/6432 size. Applications include motor control and power circuits in automotive, consumer and industrial equipment. Shunt resistors for current detection provide power supply overcurrent protection and battery level detection. For power savings, precise circuit control with high accuracy, high reliability shunt resistors are needed, the company said, and as application fun ..read more

Vishay Intertechnology, Inc. announced the second-generation of its automotive-grade IHLE series of low profile, high current inductors with integrated E-field shields. Measuring 10 × 10 mm in a 4040-case size, the Vishay Dale IHLE-4040DDEW-5A power inductors lower costs and save board space by eliminating the need for separate board-level Faraday shielding. The company claims an improved shield design over previous-generation solutions, delivering higher voltage ratings and a reduction in radiated noise interference, as well as more consistent electromagnetic interference (EMI) performa ..read more

The big drivers of 5G mobile network adoption are higher bandwidth, lower latency and higher reliability. For 5G chipmakers, this translates into a need for 5G chips and modules with higher efficiency, lower power consumption and higher integration. They are meeting the challenge with new devices that focus on greater flexibility to ease design efforts and simplify implementation, AI integration for higher performance, and power-saving features and low-power architectures. Chipmakers are now supporting 3rd Generation Partner Project (3GPP) Release 17 and Release 18 features, which includ ..read more

Congatec GmbH has unveiled new high-performance computer-on-modules (COMs) with i.MX 95 processors from NXP Semiconductors. Extending its portfolio with NXP processors, the combination provides scalability and reliable upgrade paths for energy-efficient AI applications requiring high security, the company said. (Source: Congatec GmbH) The conga-SMX95 SMARC 2.1 modules are based on the next generation of NXP i.MX 95 application processors with four to six Arm Cortex-A55 cores. NXP is now using the new Arm Mali 3D graphics unit for the first time, which delivers up to three times th ..read more

Mobix Labs Inc. has launched its latest family of EMI-filtered ARINC 404 and ARINC 600 connectors, targeting defense and aerospace applications. These new connectors are optimized for performance, cost, quality and reliability required for demanding military specifications, the company said. (Source: Mobix Labs) These connectors can be customized with planar arrays, ceramic Pi Tubes or chip capacitors to meet cost and stringent performance and reliability requirements in military applications. “Our new filtered ARINC connectors set a new standard in price, performance and customization,” sa ..read more

3GPP and CTIA test specifications now require 3D over-the-air (OTA) measurements of 5G millimeter-wave (mmWave)-capable devices under extreme temperature conditions (ETC). 3GPP requirements for RF conformance testing of user equipment (UE) are designed to avoid problems that would impair the functioning and performance of wireless networks. These 5G OTA test systems need to be optimized for airflow and thermal efficiency. Up until 5G FR1 (frequencies below 7.125 GHz), all 3GPP conformance evaluations were based on conducted measurements, connecting RF cables directly at the antenna ports of t ..read more

Migrating telecommunications, utilities, transportation, the defense sector and other critical infrastructure to 5G has spurred new phase requirements and implementation of the Open RAN system to support interoperability between cellular network equipment provided by different vendors. As a result, the industry has standardized on not just one but two precision time protocol (PTP) profiles and requires a synchronization architecture that can handle increased mobile network complexity. There is no one-size-fits-all solution to these challenges of adding 5G mobile services to 4G networks. Howev ..read more

Networks are costly from planning to deployment. They need to be more efficient to see a return on investment for 6G, which is expected to deliver these higher efficiencies. Until now, operators have experienced several significant advances, including the shift to cloud-native 5G standalone and the disaggregation of hardware and software in the RAN to help contain costs while expanding their monetization possibilities. Everything changed with AI. Viavi Solutions Inc., for example, created its 6G Forward Program, specializing in wireless technology research and testing. Creating 6G p ..read more