A technical paper titled “Optimizing Offload Performance in Heterogeneous MPSoCs” was published by researchers at ETH Zurich. Abstract: “Heterogeneous multi-core architectures combine a few “host” cores, optimized for single-thread performance, with many small energy-efficient “accelerator” cores for data-parallel processing, on a single chip. Offloading a computation to the many-core acceleration fabric introduces a communication and synchronization cost which reduces the speedup attainable on the accelerator, particularly for small and fine-grained parallel tasks. We demonstrate that by co-d ..read more

Samsung and Synopsys collaborated on the first production tapeout of a high-performance mobile SoC design, including CPUs and GPUs, using the Synopsys.ai EDA suite on Samsung Foundry’s gate-all-around (GAA) process. Samsung plans to begin mass production of 2nm process GAA chips in 2025, reports BusinessKorea. UMC developed the first radio frequency silicon on insulator (RF-SOI)-based 3D IC process for chips used in smartphones and other 5G/6G mobile devices. The process uses wafer-to-wafer bonding technology to address radio frequency interference between stacked dies and reduces die size by ..read more

A technical paper titled “Parendi: Thousand-Way Parallel RTL Simulation” was published by researchers at EPFL. Abstract: “Hardware development relies on simulations, particularly cycle-accurate RTL (Register Transfer Level) simulations, which consume significant time. As single-processor performance grows only slowly, conventional, single-threaded RTL simulation is becoming less practical for increasingly complex chips and systems. A solution is parallel RTL simulation, where ideally, simulators could run on thousands of parallel cores. However, existing simulators can only exploit tens of cor ..read more

A technical paper titled “Cryo-CMOS Voltage References for the Ultrawide Temperature Range From 300 K Down to 4.2 K” was published by researchers at Delft University of Technology, QuTech, Kavli Institute of Nanoscience Delft, and École Polytechnique Fédérale de Lausanne (EPFL). Abstract: “This article presents a family of sub-1-V, fully-CMOS voltage references adopting MOS devices in weak inversion to achieve continuous operation from room temperature (RT) down to cryogenic temperatures. Their accuracy limitations due to curvature, body effect, and mismatch are investigated and experimentally ..read more

Given computer vision’s place as the cornerstone of an increasing number of applications from ADAS to medical diagnosis and robotics, it is critical that its weak points be mitigated, such as the ability to identify corner cases or if algorithms are trained on shallow datasets. While well-known bloopers are often the result of human decisions, there are also fundamental technical issues that require further research. “Computer vision” and “machine vision” were once used nearly interchangeably, with machine vision most often referring to the hardware embodiment of vision, such as in robots. Com ..read more

Experts at the Table: Semiconductor Engineering sat down to talk about what CMOS and photonics engineers need to know to successfully collaborate, with James Pond, fellow at Ansys; Gilles Lamant, distinguished engineer at Cadence; and Mitch Heins, business development manager for photonic solutions at Synopsys. What follows are excerpts of that conversation. To view part one of this discussion, click here. Part two is here. L-R: Ansys’s Pond, Cadence’s Lamant, Synopsys’ Heins SE: What do engineers who have spent their careers in CMOS need to know about designing for photonics? Lamant:  I ..read more

Cadence’s Vatsal Patel stresses the importance of having testing and training capabilities for high-bandwidth memory to prevent the entire SoC from becoming useless and points to key HBM DRAM test instructions through IEEE 1500. In a podcast, Siemens’ Stephen V. Chavez chats with Anaya Vardya of American Standard Circuits about the growing significance of high density interconnect and Ultra HDI technologies, which enable denser component placement and increased signal integrity compared to traditional PCB designs. Synopsys’ Ian Land and Randy Fish find that silicon lifecycle management is incr ..read more

A technical paper titled “Enhancing Functional Safety in Automotive AMS Circuits through Unsupervised Machine Learning” was published by researchers at University of Texas at Dallas, Intel Corporation, NXP Semiconductors, and Texas Instruments. Abstract: “Given the widespread use of safety-critical applications in the automotive field, it is crucial to ensure the Functional Safety (FuSa) of circuits and components within automotive systems. The Analog and Mixed-Signal (AMS) circuits prevalent in these systems are more vulnerable to faults induced by parametric perturbations, noise, environment ..read more

A technical paper titled “Metrology for 2D materials: a perspective review from the international roadmap for devices and systems” was published by researchers at Arizona State University, IBM Research, Unity-SC, and the National Institute of Standards and Technology (NIST). Abstract: “The International Roadmap for Devices and Systems (IRDS) predicts the integration of 2D materials into high-volume manufacturing as channel materials within the next decade, primarily in ultra-scaled and low-power devices. While their widespread adoption in advanced chip manufacturing is evolving, the need for d ..read more

A technical paper titled “Centauri: Practical Rowhammer Fingerprinting” was published by researchers at UC Davis. Abstract: “Fingerprinters leverage the heterogeneity in hardware and software configurations to extract a device fingerprint. Fingerprinting countermeasures attempt to normalize these attributes such that they present a uniform fingerprint across different devices or present different fingerprints for the same device each time. We present Centauri, a Rowhammer fingerprinting approach that can build a unique and stable fingerprints even across devices with homogeneous or normalized ..read more