Will Arizona be the nexus of innovation for U.S. semiconductor manufacturing? It certainly looks that way. The speakers and panelists who presented at SEMI’s Arizona Breakfast Forum on May 1, confirmed what those of us who live and work here already know: The sun isn’t the only thing heating up Arizona. Whether you call it the Silicon Desert, the Semi Valley, the sixth “C”, or something completely different, all eyes are on Arizona’s semiconductor growth trajectory. And it is on fire. Arizona aims to become a hub for semiconductor innovation, building on its history dating back to Motorola in ..read more

We are excited to let you know that we registered as an exhibitor for the upcoming SEMICON SEA at MITEC, Kuala Lumpur, Malaysia from May 28 to 30. Our booth number at the event is #3813, and we would be happy if you visit us at any time during the show. If you are particularly interested in meeting with us, please send us your contact details so that we can arrange a more meaningful meeting. What you will find at our booth: PCB and IC Substrate samples AT&S technologies Technical experts for a technical exchange Explore AT&S World with VR headsets Freebies As a globally leading manuf ..read more

Siemens Digital Industries Software today introduced Solido IP Validation Suite software, a comprehensive, automated signoff solution for quality assurance across all IC design intellectual property (IP) types, including standard cells, memories, and IP blocks. This new solution provides complete quality assurance (QA) coverage across all IP design views and formats, as well as version-to-version IP qualification for more predictable full-chip IP integration cycles and faster time-to-market. Integration of off–the-shelf design IP for next-generation semiconductor designs continues to expand du ..read more

Focuses remaining business on Liquid Metal Inks for AI & High-Performance Computing LQDX (lick-QUID-ix), formerly known as Averatek Corp., developer of high-performance materials for advanced semiconductor manufacturing, today announced that it has divested its aluminum soldering business – known as MinaTM – to Taiyo America Inc., a global market leader in advanced electronic materials. The new relationship enables the scale-up of existing sales support and manufacturing and a partnership to build further product traction. “We are excited to complete this transaction with Taiyo,” said&nbs ..read more

StratEdge is set to showcase its latest high-frequency packaging technology at several industry conferences in May. The events will take place in California and Arizona and will highlight StratEdge’s commitment to producing packages for demanding GaAs and GaN devices, maximizing the chips’ performance in the most extreme conditions. StratEdge will be exhibiting at the Components for Military & Space Electronics Conference & Exhibition—CMSE, held in Los Angeles, CA from May 1-2. The company will be located at Booth B20. StratEdge will showcase power amplifier packages at Space Tech Expo ..read more

As the semiconductor industry continues to experience a surge of innovation, companies worldwide are collaborating to propel technology forward while also addressing sustainability issues and investing in STEM education. From pioneering product debuts and events to strategic alliances and efforts in workforce development, our members had lots of news to share. Here is our monthly dive into the notable highlights of our member news, events, and advancements from the past month. Celebrating Sustainability on Earth Day Brewer Science proudly announces its ninth consecutive Zero Waste to Land ..read more

The university setting offers a valuable environment for future engineers to explore and learn about technologies that will become part of their daily lives when transitioning from school to a career. At the same time, universities working on microelectronics and advanced R&D are increasingly looking for more advanced manufacturing equipment that offers both reasonable upfront investment costs, and a low cost of ownership. Over the next five years, we will see significant changes in the kinds of microelectronics projects and programs universities pursue. University fabs are moving toward a ..read more

 Nordson Electronics Solutions, a global leader in electronics manufacturing technologies, received the conformal coating equipment award from EM Asia China for the new ASYMTEK Select Coat® SL-1040 conformal coating system, at an award ceremony during Productronica China, held March 21 in the Shanghai New International Expo Centre, Shanghai, China. The SL-1040 system, publicly introduced in November 2023, is the most advanced conformal coating solution for high-volume production for printed circuit assembly. Designed to meet the dynamic demands of electronics manufacturers, especially for ..read more

Design Tool Certifications Support Newest Processes and Other Enablement Milestones Today at the TSMC 2024 North America Technology Symposium, Siemens Digital Industries Software announced that ongoing collaboration with longtime partner TSMC has successfully achieved multiple new product certifications and project milestones for TSMC’s newest and most advanced processes. For mutual customers, these certifications allow the development of innovative and highly differentiated end-products using best-in-class EDA software industry-leading silicon process,es and advanced packaging technologies ..read more

StratEdge has been designing and manufacturing packages for high-power, high-frequency compound semiconductors since the early 1990s, with much attention focused on gallium arsenide (GaAs) and gallium nitride (GaN). Because of its ability to operate at very high currents and high voltages, gallium nitride GaN is widely used in applications for high-power devices operating at high frequencies. While much attention is given to GaN devices, what is often overlooked is the package in which the GaN device is attached and the way the device is attached to the package. It’s well known that GaN device ..read more