Lenovo Unveils Yoga Slim 7x 14 Gen 14 and ThinkPad T14 Gen 6 Notebooks Powered By Qualcomm Snapdragon X Elite
AnandTech » Virtual Reality
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7h ago
While we've been expecting the availability of the Qualcomm Snapdragon X Elite processor to be around the middle of this year, Lenovo has announced two new 'AI-powered' notebooks for the Windows on Arm platform. Announced is the Lenovo Yoga Slim 7x Gen 14 and the Lenovo ThinkPad T14s Gen 6 both feature Qualcomm's latest 12-core Snapdragon X Elite processor, ushering in a new era for Microsoft's Windows on Arm platform. Lenovo aims to target content creators and business professionals with these new models. Qualcomm's new Snapdragon X Elite processor looks set to try to change the adoptio ..read more
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Intel Teases Lunar Lake CPU Ahead of Computex: Most Power Efficient x86 Chip Yet
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7h ago
The next few weeks in the PC industry are going to come fast and furious. Between today and mid-June are multiple conferences and trade-shows, including Microsoft Build and the king of PC trade shows: Computex Taiwan. With all three PC CPU vendors set to present, there’s a lot going on, and a lot of product announcements to be had. But even before those trade shows start, Intel is looking to make the first move this afternoon with an early preview on its next-gen mobile processor, Lunar Lake. While Intel hasn’t said too much about what to expect from their Computex 2024 keynote thus far, it’s ..read more
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TSMC Outlines Path to EUV Success: More Tools, More Wafers, & Best Pellicles In Industry
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3d ago
Although TSMC can't claim to be the first fab to use extreme UV (EUV) lithography – that title goes to Samsung – they do get to claim to be the largest. As a result, the company has developed significant experience with EUV over the years, allowing TSMC to refine how they use EUV tooling to both improve productivity/uptime, and to cut down on the costs of using the ultra-fine tools. As part of the company's European Technology Symposium this week, they went into a bit more detail on their EUV usage history, and their progress on further integrating EUV into future process nodes. When TSMC sta ..read more
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Capsule Review: Sunon Maglev 120mm Fan
AnandTech » Virtual Reality
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3d ago
Founded in 1980 and headquartered in Taiwan, Sunon (aka Sunonwealth Electric Machine Industry Co., Ltd.), stands out as a prominent global producer of fans, blowers, and thermal management systems. The company has made a name for itself in the fan industry with a comprehensive product line that includes DC brushless fans, micro blowers, CPU coolers, and various other cooling technologies. They are one of the oldest and most renowned fan manufacturers on the world – and not just for PC applications, but for just about anything in need of something smaller than a ceiling fan, spanning from ..read more
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Not Dead Yet: WD Releases New 6TB 2.5-Inch External Hard Drives - First Upgrade in Seven Years
AnandTech » Virtual Reality
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4d ago
The vast majority of laptops nowadays use solid-state drives, which is why the development of new, higher-capacity 2.5-inch hard drives has all but come to a halt. Or rather, it almost has. It seems that the 2.5-inch form factor has a bit more life left in it after all, as today Western Digital has released a slate of new external storage products based on a new, high-capacity 6 TB 2.5-inch hard drive. WD's new 6 TB spinner is being used to offer upgraded versions of the company's My Passport, Black P10, and and G-DRIVE ArmorATD portable storage products. Notably, however, WD isn't selling th ..read more
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TSMC to Expand Specialty Capacity by 50%, Introduce 4nm N4e Low-Power Node
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4d ago
With all the new fabs being built in Germany and Japan, as well as the expansion of production capacity in China, TSMC is planning to extend its production capacity for specialty technologies by 50% by 2027. As disclosed by the company during its European Technology Symposium this week, TSMC expects to need to not only convert existing capacity to meet demands for specialty processes, but even build new (greenfield) fab space just for this purpose. One of the big drivers for this demand, in turn, will be TSMC's next specialty node: N4e, a 4nm-class ultra-low-power production node. "In the pas ..read more
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The Arctic Cooling Freezer 36 ARGB CPU Cooler Review: Budget Cooling Done Well
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4d ago
As modern high-performance CPUs generate more heat, there's been a noticeable increase in the demand for powerful air coolers capable of managing these thermal challenges. Traditional stock air coolers, while sufficient for regular use, are typically designed to be cheap and relatively compact, leaving further improvements to noise control and peak cooling efficiency on the table. This gap has long prompted advanced users and system builders to opt for high-quality aftermarket coolers that designed to better handle the heat output from top-tier processors. Known for their innovative approach t ..read more
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TSMC Readies Next-Gen HBM4 Base Dies, Built on 12nm and 5nm Nodes
AnandTech » Virtual Reality
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4d ago
Of the several major changes coming with HBM4 memory, one of the most immediate is the sheer width of the memory interface. With the fourth-generation memory standard moving from an already wide 1024-bit interface to a ultra-wide 2048-bit interface, HBM4 memory stacks won't be business as usual; chip manufacturers are going to need to adopt more advanced packaging methods than are used today to accommodate the wider memory. As part of its European Technology Symposium 2024 presentation, TSMC offered some fresh details into the base dies it will be manufacturing for HBM4, which will be built u ..read more
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TSMC: Performance-Optimized 3nm N3P Process on Track for Mass Production This Year
AnandTech » Virtual Reality
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5d ago
As part of the second leg of TSMC's spring technology symposium series, the company offered an update on the state of its 3nm-class processes, both current and future. Building on the back of their current-generation N3E process, the optical shrink of this process technology, N3P, is now on track to enter mass production in the second half of 2024. Thanks to that shrink, N3P is expected to offer both increased performance efficiency as well as increased transistor density over N3E. N3E in Production, Yielding Well With N3E already in volume production, TSMC is reporting that they're seeing "g ..read more
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Supermicro E102-13R-H Review: A Raptor Lake-P 3.5" SBC System for Embedded Applications
AnandTech » Virtual Reality
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6d ago
Single-board computers in the 3.5" form-factor have become extremely popular for embedded applications involving a mix of high performance requirements as well as extended peripherals support. Typical use-case scenarios include digital signage, edge inferencing solutions, retail applications, and IoT gateways. The requirements in these segments call for processors and components that can operate in a wide temperature range. The chassis and cooling solution handle other duties such as ruggedness and avoidance of moving parts. The Supermicro X13SRN-H-WOHS is a 3.5" SBC with a soldered-down Intel ..read more
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