GDDR7 Approaches: Samsung Lists GDDR7 Memory Chips on Its Product Catalog
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15h ago
Now that JEDEC has published specification of GDDR7 memory, memory manufacturers are beginning to announce their initial products. The first out of the gate for this generation is Samsung, which has has quietly added its GDDR7 products to its official product catalog. For now, Samsung lists two GDDR7 devices on its website: 16 Gbit chips rated for an up to 28 GT/s data transfer rate and a faster version running at up to 32 GT/s data transfer rate (which is in line with initial parts that Samsung announced in mid-2023). The chips feature a 512M x32 organization and come in a 266-pin FBGA packa ..read more
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Report: SK Hynix Mulls Building $4 Billion Advanced Packaging Facility in Indiana
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1d ago
SK hynix is considering whether to build an advanced packaging facility in Indiana, reports the Wall Street Journal. If the company proceeds with the plan, it intends to invest $4 billion in it and construct one of the world's largest advanced packaging facilities. But to accomplish the project, SK hynix expects it will need help from the U.S. government. Acknowledging the report but stopping short of confirming the company's plans, a company spokeswoman told the WSJ that SK hynix "is reviewing its advanced chip packaging investment in the U.S., but hasn’t made a final decision yet." Companie ..read more
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Intel Announces Expansion to AI PC Dev Program, Aims to Reach More Software & Hardware Devs
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1d ago
Today, Intel announced that it is looking to progress its AI PC Acceleration program further by offering various new toolkits and devkits designed for software and hardware AI developers under a new AI PC Developer Program sub-initiative. Originally launched on October 23, the AI PC Acceleration program was created to connect hardware vendors with software developers, using Intel's vast resources and experience to develop a broader ecosystem as the world pivots to one driven by AI development. Intel aims to maximize the potential of AI applications and software and broaden the whole AI-focuse ..read more
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The DeepCool PX850G 850W PSU Review: Less Than Quiet, More Than Capable
AnandTech » Virtual Reality
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2d ago
DeepCool is one of the few veterans in the PC power & cooling components field still active today. The Chinese company was first founded in 1996 and initially produced only coolers and cooling accessories, but quickly diversified into the PC Case and power supply unit (PSU) markets. To this day, DeepCool stays almost entirely focused on PC power & cooling products, with input devices and mousepads being their latest diversification attempt. Today's review turns the spotlight toward DeepCool’s PSUs and, more specifically, the PX850G 850W ATX 3.0 PSU, which currently is their most popula ..read more
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Construction of $106B SK hynix Mega Fab Site Moving Along, But At Slower Pace
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5d ago
When a major industry slowdown occurs, big companies tend to slowdown their mid-term and long-term capacity related investments. This is exactly what happened to SK hynix's Yongin Semiconductor Cluster, a major project announced in April 2021 and valued at $106 billion. While development of the site has been largely completed, only 35% of the initial shell building has been constructed, according to the Korean Ministry of Trade, Industry, and Energy. "Approximately 35% of Fab 1 has been completed so far and site renovation is in smooth progress," a statement by the Korean Ministry of Trade, I ..read more
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Micron Samples 256 GB DDR5-8800 MCR DIMMs: Massive Modules for Massive Servers
AnandTech » Virtual Reality
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6d ago
Micron this week announced that it had begun sampling of its 256 GB multiplexer combined (MCR) DIMMs, the company's highest-capacity memory modules to date. These brand-new DDR5-based MCRDIMMs are aimed at next-generation servers, particularly those powered by Intel's Xeon Scalable 'Granite Rapids' processors that are set to support 12 or 24 memory slots per socket. Usage of these modules can enable datacenter machines with 3 TB or 6 TB of memory, with the combined ranks allowing for effect data rates of DDR5-8800. "We also started sampling our 256 GB MCRDIMM module, which further enhances pe ..read more
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Micron Sells Out Entire HBM3E Supply for 2024, Most of 2025
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6d ago
Being the first company to ship HBM3E memory has its perks for Micron, as the company has revealed that is has managed to sell out the entire supply of its advanced high-bandwidth memory or 2024, while most of their 2025 production has been allocated, as well. Micron's HBM3E memory (or how Micron alternatively calls it, HBM3 Gen2) was one of the first to be qualified for NVIDIA's updated H200/GH200 accelerators, so it looks like the DRAM maker will be a key supplier to the green company. "Our HBM is sold out for calendar 2024, and the overwhelming majority of our 2025 supply has already been ..read more
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NVIDIA's GPU IP Drives into MediaTek's Dimension Auto SoCs
AnandTech » Virtual Reality
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6d ago
MediaTek this week has introduced a new lineup of Dimensity Auto Cockpit system-on-chips, covering the entire market spectrum from entry-level to premium. And while automotive chip announcements are admittedly not normally the most interesting of things, this one is going to be an exception to that rule because of whose graphics IP MediaTek is tapping for the chips: NVIDIA's. This means the upcoming Dimensity Auto Cockpit chips will be the first chips to be released by a third-party (non-NVIDIA) vendor to be based around NVIDIA's GeForce graphics technology. NVIDIA's first attempt to license ..read more
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AMD Announces FSR 3.1: Seriously Improved Upscaling Quality
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1w ago
AMD's FidelityFX Super Resolution 3 technology package introduced a plethora of enhancements to the FSR technology on Radeon RX 6000 and 7000-series graphics cards last September. But perfection has no limits, so this week, the company is rolling out its FSR 3.1 technology, which improves upscaling quality, decouples frame generation from AMD's upscaling, and makes it easier for developers to work with FSR. Arguably, AMD's FSR 3.1's primary enhancement is its improved temporal upscaling image quality: compared to FSR 2.2, the image flickers less at rest and no longer ghosts when in movement ..read more
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Ultra Ethernet Consortium Grows to 55 Members, Reveals Some Details on Upcoming HPC Backbone Tech
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1w ago
The Ultra Ethernet Consortium (UEC) has announced this week that the next-generation interconnection consortium has grown to 55 members. And as the group works towards developing the initial version of their ultra-fast Ethernet standard, they have released some of the first technical details on the upcoming standard. Formed in the summer of 2023, the UEC aims to develop a new standard for interconnection for AI and HPC datacenter needs, serving as a de-facto (if not de-jure) alternative to InfiniBand, which is largely under the control of NVIDIA these days. The UEC began to accept new me ..read more
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