Netint Joins Ampere’s AI Platform Alliance
EE Times
by Sally Ward-Foxton
13h ago
Video processing unit (VPU) maker Netint has joined the AI Platform Alliance, an Ampere-led initiative whose members plan to work together to validate joint AI solutions for the market. The aim of the ..read more
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Electroforming Provides Lifesaving Medical Tech for Newborns
EE Times
by Ray Lumina
20h ago
Medical technology is a growing field that requires fast, high-quality turnaround from advanced manufacturers to meet the demands and advancements of the healthcare industry, particularly in the realm of ..read more
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Diamond Breakthroughs Shape Future of High-Performance Electronics
EE Times
by Maurizio Di Paolo Emilio
1d ago
Diamond, renowned for its exceptional properties, has long held promise for various applications, yet its potential as a semiconductor has faced hurdles hindering commercialization. Recent strides made by ..read more
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Exploring the Intersection of Neuronal Cultures, Robotics and AI
EE Times
by Pablo Valerio
1d ago
The human brain continues to baffle scientists with its intricate dance of neurons. Understanding this biological marvel and replicating its information-processing capabilities have been relentless pursuits ..read more
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TIRIAS Research Analysts Talk Intel Vision 2024
EE Times
by Francis Sideco
3d ago
TIRIAS Research principal analysts Jim McGregor and Francis Sideco unpack the major announcements from Intel Vision 2024, especially what the Gaudi 3 announcement means for the data center AI accelerator ..read more
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Syntiant Pitches Latest Low-Power AI Chip as LLM Companion
EE Times
by Sally Ward-Foxton
3d ago
Ultra-low-power edge AI specialist Syntiant has unveiled a third generation of its at-memory compute core, with 5× the tensor throughput of previous-generation Syntiant devices. The new core features the ..read more
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Microchip’s HPD Modules Advance Aircraft Electrification
EE Times
by Maurizio Di Paolo Emilio
6d ago
Microchip Technology has introduced a new integrated actuation power solution in response to the aviation industry’s demand for more environmentally sustainable and energy-efficient aircraft systems. This ..read more
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Untether Collaborates With Arm For Automotive AI
EE Times
by Sally Ward-Foxton
1w ago
Untether AI has collaborated with Arm to enable Untether’s AI inference accelerators to work with the latest generation of Arm automotive enhanced (AE) technology for autonomous vehicles (AVs) and advanced ..read more
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Neuchips Driving AI Innovations in Inferencing
EE Times
by Stephen Las Marias
1w ago
The global semiconductor market experienced a challenging year in 2023. According to the Semiconductor Industry Association (SIA), worldwide chip sales reached $526.8 billion in 2023, down by 8.2 ..read more
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GUC Provides 3DIC ASIC Total Service Package to AI, HPC, and Networking Customers
EE Times
by Global Unichip Corp.
1w ago
Global Unichip Corp. (GUC), the Advanced ASIC Leader, announced today that the GLink-3D interface (GUC’s Link for 3D die stacking) for the TSMC 3DFabric SoIC-X 3D stacking platform passed comprehensive ..read more
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