Press release: https://voxelsensors.com/wp-content/uploads/2023/05/VoxelSensors_Announces_Seed_Round_Closing_May-17-2023-_-RC_FINAL.pdf Brussels (Belgium), May 17, 2023 - VoxelSensors today announces an investment of €5M led by Belgian venture capital firms Capricorn Partners and Qbic, with participation from the investment firm finance&invest.brussels, existing investors and the team. VoxelSensors’ Switching Pixels® Active Event Sensor (SPAES) is a novel category of ultra-low power and ultra-low latency 3D perception sensors for Extended Reality (XR)1 to blend the physical and digital wor ..read more

CNES, ESA, LABEX FOCUS, ONERA, CEA-LETI, AIRBUS DEFENCE & SPACE, THALES ALENIA SPACE are pleased to invite you to the “Infrared detection for space application” workshop to be held in TOULOUSE from June 7th to 9th, 2023   Registration deadline is June 1st, 2023.   Workshop registration link : https://site.evenium.net/2yp0cj0h ..read more

Hendrickson et al. have posted two new pre-prints on deep sub-electron read noise (DSERN) characterization. This new algorithm called PCH-EM is used to extract key performance parameters of sensors with sub-electron read noise through a custom implementation of the Expectation Maximization (EM) algorithm. It shows a dramatic improvement over the traditional Photon Transfer (PT) method in the sub-electron noise regime. The authors have some extensions and improvements of the method coming soon as well. The first pre-print titled "Photon Counting Histogram Expectation Maximization Algorithm for ..read more

SCD.USA has released an event based SWIR sensor/camera. Official press release: https://scdusa-ir.com/articles/advanced-multi-function-ingaas-detectors-for-swir/     IMV Europe   Defence imaging goes next-gen with event-based SWIR camera https://www.imveurope.com/content/defence-imaging-goes-next-gen-event-based-swir-camera    Also:  https://www.imveurope.com/content/scd-launches-worlds-first-event-based-swir-detector   Semi Conductor Devices (SCD), a manufacturer of uncooled infrared detectors and high-power laser diodes, has launched a new SWIR detector ..read more

News from: https://ala.associates/funding/lynred-breaks-ground-on-new-e85m-industrial-site-for-infrared-technologies/ Also from Yole: https://www.yolegroup.com/industry-news/lynred-breaks-ground-on-new-e85m-industrial-site-for-infrared-technologies/ Lynred breaks ground on new €85M industrial site for infrared technologies  Named Campus, Lynred’s new state-of-the-art industrial facility will meet growing market demand for advanced infrared technologies, notably for automotive sector, whilst bolstering French industrial sovereignty in field   Company’s production capacity set to unde ..read more

The call for poster and demo submissions for the IEEE International Conference on Computational Photography (ICCP 2023) is now open. The call is on the website and is available here. Whereas ICCP papers must describe original research, the posters, and demos give an opportunity to showcase previously published or yet-to-be-published work to a broader community. The poster track is non-exclusive, and papers submitted to the paper or abstract tracks of ICCP are welcome to present a poster as well. ICCP is at the rich intersection of optics, graphics, imaging, vision and design. The posters an ..read more

A review article in Nature Communications by Wang et al. (Shanghai Institute of Technical Physics) discusses techniques for characterizing 2D photodetectors. Full paper: https://www.nature.com/articles/s41467-023-37635-1 Abstract: Photodetectors based on two-dimensional (2D) materials have been the focus of intensive research and development over the past decade. However, a gap has long persisted between fundamental research and mature applications. One of the main reasons behind this gap has been the lack of a practical and unified approach for the characterization of their figures of merit ..read more

  Link: https://www.sony.com/en/SonyInfo/IR/library/presen/er ..read more

CMOS Image Sensor Layers at a Glance The onsemi CMOS Image Sensor Wafer consists of the following layers: • Microlens Array—Small lenses that collect and focus light onto light-sensitive areas of the sensor. • Color Filter Array (CFA)—Mosaic of tiny color filters placed over the pixel sensors of an image sensor to capture color information. • Photodiode—Semiconductor that converts light into an electrical current. • Pixel Transistors—Transistors provide gain or bugger of electrical charge from the photodiode. • Bond Layer—Connects the Active Pixel Array to the ASIC layer • ASIC—Logic layer f ..read more

Miyazawa et al. from Shizuoka University in Japan recently published an article titled "A Time-of-Flight Image Sensor Using 8-Tap P-N Junction Demodulator Pixels" in the MDPI Sensors journal. [Open access: https://www.mdpi.com/1424-8220/23/8/3987] Abstract: This paper presents a time-of-flight image sensor based on 8-Tap P-N junction demodulator (PND) pixels, which is designed for hybrid-type short-pulse (SP)-based ToF measurements under strong ambient light. The 8-tap demodulator implemented with multiple p-n junctions used for modulating the electric potential to transfer photoelectrons to e ..read more